Diamond polishing disc process

ABSTRACT

A diamond polishing disc process includes the following steps. First, an adhesive material is coated on outer sides of the woven layer with a plurality of meshes, so as to form an adhesive layer. Next, the adhesive layer is adhered in an accommodation unit. Afterwards, pluralities of diamond particles are implanted in the adhesive layer, and are respectively adhered in each mesh of the adhesive layer. Then, a polymer material is filled into the accommodation unit, so as to fix the diamond particles to the polymer material. Finally, cure the polymer material, and remove it with the diamond particles from the accommodation unit, thus obtaining a diamond polishing disc base with the diamond particles arranged uniformly and having consistent in orientations.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 096100567 filed in Taiwan, R.O.C. on Jan. 5, 2007, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to a diamond polishing disc process, and more particularly to a diamond polishing disc process for manufacturing a disc with diamond particles of consistent orientations.

2. Related Art

In recent years, with the rapid development and maturity of the integrated circuit (IC) technology, the semiconductor industry has become one of the most vigorous industries. The semiconductor products are widely applied in fields such as information, communication, consumptive electronics, industrial instruments, transportations, and national defense and space. Thus, the semiconductor industry has a great impact on electronic products, and is undoubtedly important.

In the semiconductor industry, silicon wafers have become a critical material. The silicon wafers must first go through a chemical mechanical polishing (CMP) process to have its surface flattened, and then the chips are fabricated thereon in the subsequent process, thereby enhancing the accuracy and yield of the process. As polishing pads are used in the CMP process, after long periods of usage, abrasive particles may fall into the gaps of the polishing pad, which reduces the efficiency of the polishing pad. Therefore, the polishing pad must be conditioned regularly to remove the residual impurities and scraps after polishing, so as to remain in the best state of the polishing pads. Thus, in the semiconductor industry, high hardness of diamonds is applied to a pad conditioner for conditioning the polishing pad. The pad conditioner is disc-shaped or annular-shaped, and is also referred to as the diamond polishing disc pad conditioner.

In the conventional manufacturing methods of the diamond polishing disc, a metal bonding layer is formed by an electroplating process or a sintering process, so as to cover the diamond particles and fix the diamond particles to the surface of a metal substrate. However, neither of the two conventional manufacturing methods of a diamond polishing discs can provide a sufficient bonding force to firmly fix the diamond particles to the surface of the metal substrate. Thus, the diamond particles may easily fall from the diamond polishing disc pad conditioner due to the insufficient bonding force, thus damaging the surface of the silicon wafer. Therefore, a brazing process must be added to enhance the bonding of the diamond particles, which may lead to an additional process and increased costs.

Further, in order to extend the service life and enhance the polishing performance of the disk pad conditioner, Taiwan Patent No. 412461 and U.S. Pat. No. 5,092,910 have disclosed a method of using a die hole or screen with regularly distributed holes to make diamond particles regularly arranged in a pattern on an abrasive tool, which replaces the conventional way of arranging diamond particles in a random and irregular manner on an abrasive tool. Moreover, Taiwan Patent No. 541226 discloses a method of arranging diamond particles uniformly at the same heights, in which abrasive particles are spaced at a suitable distance and arranged in a positioning groove in a carrier, and a bonding material is filled into the groove to make the abrasive particles arranged in consistent orientations.

Patent No. 412461 and U.S. Pat. No. 5,092,910 may achieve the purpose of uniformly arranging the diamond particles with a proper distance. However, the mesh size of the die hole or screen is greater than the diameter of the diamond particles that results in diamond particles can be only arranged regularly according to the positions of the meshes, but the orientations of the arranged diamond particles is hard to control Therefore, the heights of diamond particles protruding from the diamond polishing disc are different, which may greatly affect the uniformity of polishing and service life of the diamond polishing disc pad conditioner. Furthermore, after the diamond particles are arranged on the surface of a wafer, a brazing process is still needed to perform that enables the diamond particles and the wafer are firmly bonded together, and thus raising the problems of the substrate deformation and degradation of the diamond particles. In Patent No. 541226, the carrier on which the diamond particles are arranged must first be milled with a positioning groove in a predetermined shape, and thus the manufacturing cost is increased due to the additional processing on the carrier. Besides, in order to make the diamond particles having consistent in orientations, more time will be spent on laying the diamond particles, and thereby the production efficiency cannot be improved.

According to the above conventional manufacturing methods of a diamond polishing disc, though the diamond particles may be arranged uniformly and regularly, they cannot be consistent in orientations. Otherwise, higher cost and more time will be needed to arrange the abrasive particles in consistent orientations, which are not economical and will reduce the production.

SUMMARY OF THE INVENTION

In view of the above problem, the present invention provides a diamond polishing disc process for solving the problems in the prior art that the diamond particles are arranged non-uniformly and oriented randomly, the diamond particles are arranged at different heights and the manufacturing process is too complicated, such that the manufacturing cost is too high and the production efficiency is low.

A diamond polishing disc process of the present invention includes the following steps. Firstly, a woven layer with a plurality of meshes is provided, and an adhesive material is coated on both sides of the woven layer, so as to form an adhesive layer. Next, an accommodation unit is provided, and the adhesive layer is adhered in the accommodation unit. Afterwards, a plurality of diamond particles is implanted in the adhesive layer, and the diamond particles are respectively adhered in each mesh of the adhesive layer. Then, a polymer material is filled into the accommodation unit to fix the diamond particles to the polymer material. Finally, cure the polymer material, and remove the polymer with the diamond particles from the accommodation unit, thereby obtaining a diamond polishing disc base with the diamond particles uniformly distributed and having consistent in orientations.

The advantage of the present invention lies in that, the adhesive layer with a mesh size smaller than the diameter of the diamond particles is employed, forcing the diamond particles to be embedded and adhered in the meshes at a certain angle, such that the diamond particles are uniformly distributed and have consistent orientations. Moreover, a polymer material is adopted to provide sufficient adhesion for the diamond particles, so the brazing process will not be required, thus simplifying the diamond polishing disc process and meanwhile reducing the manufacturing cost.

Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understand from the detailed description given herein below for illustration only, and thus are not limitative of the present invention, and wherein:

FIG. 1 is a schematic perspective view of an adhesive layer of the present invention;

FIG. 2 is a schematic perspective view of the present invention, wherein an adhesive layer is attached on a flat disc depending on a hollow area formed by an alignment fixture fitted on the periphery of a flat disc;

FIG. 3A is a schematic perspective view of the present invention, wherein an outer ring corresponding to the flat disc is fitted on the periphery of a flat disc;

FIG. 3B is a schematic cross-sectional view of the present invention according to FIG. 3A;

FIG. 4A is a schematic perspective view of the present invention, wherein a plurality of diamond particles is implanted to a adhesive layer;

FIG. 4B is a schematic cross-sectional view of the present invention according to FIG. 4A;

FIG. 5A is a schematic perspective view of the present invention, wherein a polymer material is filled into a accommodation unit;

FIG. 5B is a schematic cross-sectional view of the present invention according to FIG. 5A;

FIG. 6A is a schematic perspective view of separate steps of the present invention, wherein a plurality of diamonds is firmly fixed to a polymer material;

FIG. 6B is a schematic cross-sectional view of the present invention according to FIG. 6A;

FIG. 7A is a schematic perspective view of the present invention, wherein a curing gel is optionally covered on a hardened polymer material;

FIG. 7B is a schematic cross-sectional view of the present invention according to FIG. 7A;

FIG. 8A is a schematic cross-sectional view of adhering diamond particles in meshes of different sizes according to the present invention;

FIG. 8B is a schematic cross-sectional view of adhering diamond particles in meshes of different sizes according to the present invention;

FIG. 9A is a schematic cross-sectional view of a flat disc with a different configuration according to the present invention;

FIG. 9B is a schematic cross-sectional view of a flat disc with a different configuration according to the present invention; and

FIG. 10 is a flow chart of the process of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1 to 10, schematic views and flow charts of a diamond polishing disc process of the present invention are shown.

In FIG. 1 and FIG. 10, firstly, a woven layer 221 having a plurality of meshes is provided, and an adhesive material 222 is coated on both sides of the woven layer 221 to form an adhesive layer 220 (Step 100). The woven layer 221 of the present invention is a nylon net interwoven by a plurality of nylon lines, and a plurality of meshes with a size of 190 μm to 220 μm is formed. The adhesive material 222 is, but not limited to, an adhesive soft material such as low-viscosity adhesive tape and clay.

Next, as shown in FIGS. 2, 3A, 3B, and 10, an accommodation unit 210 is provided to serve as a working platform for fabricating the diamond polishing disc, and the adhesive layer 220 is adhered in the accommodation unit 210 (Step 110). The adhesive layer 220 is attached on a flat disc 211 depending on a hollow area formed by an alignment fixture 260 fitted on the periphery of the flat disc 211. After the adhesive layer 220 is attached to the flat disc 211, the alignment fixture 260 is removed from the flat disc 211, thus obtaining a flat disc 211 with an adhesive layer 220. Afterwards, an outer ring 212 corresponding to the flat disc 211 is fitted on the periphery of the flat disc 211, so as to form an accommodation unit 210 with a hollow structure. In addition, the alignment fixture 260 is slightly higher than the flat disc 211, which is convenient for an operator to accurately attach the adhesive layer 220 to the flat disc 211. Meanwhile, since the outer ring 212 is relatively higher than the alignment fixture 260, a sufficient operating space is formed.

Then, please refer to FIGS. 4A, 4B, and 10, a plurality of diamond particles 230 is implanted to the adhesive layer 220, and a proper pressure is exerted to make the diamond particles 230 respectively adhere in each mesh of the adhesive layer 220 (Step 120). The diameter of the diamond particles 230 embedded and adhered in the meshes is about 250 μm to 300 μm, i.e., the diameter of the diamond particles 230 is slightly larger than the mesh size of the adhesive layer 220. Therefore, when a pressure is exerted to implant the diamond particles 230 in the adhesive layer 220, the diamond particles 230 are embedded and adhered with the end of an acute angle in the meshes of the adhesive layer 220. So, the diamond particles 230 are uniformly distributed and have consistent in orientations.

Afterwards, referring to FIGS. 5A, 5B, and 10, a polymer material 240 is filled into the accommodation unit 210 (Step 130), and covers the diamond particles 230 adhered in the adhesive layer 220. The polymer material 240 serves as a substrate material for fabricating the diamond polishing disc. In the present invention, the polymer material 240 is an epoxy resin and serves as a bond for the diamond particles 230. In this manner, problems of substrate deformation and degradation of the diamond particles caused by high-temperature brazing in the conventional art are avoided.

Next, as shown in FIGS. 6A, 6B, and 10, the polymer material 240 is self-cured or cured by a certain process to make the diamond particles 230 firmly fixed to the polymer material 240. As such, the polymer material 240 is removed together with the diamond particles 230 from the accommodation unit 210 (Step 140), so as to obtain a disc-shaped base made of the polymer material 240 with the diamond particles 230 which are uniformly distributed and have consistent orientations.

Then, referring to FIGS. 7A, 7B, and 10, the surface of the obtained disk-shaped polymer material 240 is not flat. Thus, in order to improve the overall flatness of the diamond polishing disc and solve the problem of the depression of the polymer material 240 on the periphery of the diamond particles 230, a curing gel 250 is optionally cladded on the hardened polymer material 240 (Step 150). The curing gel 250 is an UV glue, which is hardened under the radiation of an UV light, so as to obtain a diamond polishing disc base with the flat surface and the diamond particles 230.

After that, referring to FIGS. 8A and 8B, the meshes of the adhesive layer 220 may be designed in the same size. Moreover, the meshes on the outer edge of the adhesive layer 220 may be designed to have sizes slightly smaller than those in the center, so as to form a diamond polishing disc base in which the diamond particles 230 embedded in the outer edge are arranged with the end of an acute angle pointing upwardly, and those in the center are arranged with the end of a non-acute angle pointing upwardly. Or, the meshes on the outer edge of the adhesive layer 220 may be designed to have sizes slightly greater than those in the center, so as to form a diamond polishing disc base in which the diamond particles 230 embedded in the outer edge are arranged with the end of a non-acute angle pointing upwardly, and those in the center are arranged with the end of an acute angle pointing upwardly. The above designs can meet the actual requirements of the diamond polishing disc on polishing, and the sizes and arrangements of the meshes are not limited to those disclosed in the present invention.

Next, referring to FIGS. 9A and 9B, besides having a flat surface, the flat disc 211 may also have a protrusion 2111 or a recess 2112 at the center thereof. Then, the polymer material 240 is filled into an accommodation space enclosed by the outer ring 212, and is molded to obtain a diamond polishing disc base with a depressed or raised center. By altering the surface configuration of the flat disc 211, a base made of the polymer material 240 having a predetermined shape corresponding to the surface configuration of the flat disc 211 may be obtained. In addition, those skilled in the art can change the surface configuration of the flat disc 211 into different geometric shapes so as to meet actual requirements of the diamond polishing disc on polishing, and the surface configuration of the flat disc 211 is not limited to the embodiment of the present invention.

In the diamond polishing disc process of the present invention, the diamond particles serving as an abrasive are adhered on the adhesive layer at a certain angle according to the arrangement of the meshes of the adhesive layer, so that the diamond particles are uniformly distributed and have consistent orientations, thus enhancing the polishing and cutting performances of the diamond polishing disc and achieving an optimal polishing effect. Meanwhile, the service life of the diamond polishing disc may be extended. Further, the present invention utilizes the adhesion of the polymer material to form a diamond polishing disc base without using any additional brazing process, thereby simplifying the diamond polishing disc process and reducing the manufacturing cost. 

1. A diamond polishing disc process, comprising: providing a woven layer having a plurality of meshes, and coating an adhesive material on outer sides of the woven layer so as to form an adhesive layer; providing an accommodation unit, and adhering the adhesive layer in the accommodation unit; implanting a plurality of diamond particles on the adhesive layer, the diamond particles are adhered to each of meshes respectively; filling a polymer material into the accommodation unit to cover the diamond particles, such that the diamond particles are fixed to the polymer material; curing the polymer material; and removing the polymer material with the diamond particles together from the accommodation unit.
 2. The diamond polishing disc process as claimed in claim 1, further comprising covering a curing gel on the hardened polymer material.
 3. The diamond polishing disc process as claimed in claim 2, wherein the curing gel is an UV glue.
 4. The diamond polishing disc process as claimed in claim 1, wherein the step of adhering the adhesive layer in the accommodation unit further comprises attaching the adhesive layer to a flat disc, and fitting an outer ring on the flat disc so as to form the accommodation unit.
 5. The diamond polishing disc process as claimed in claim 4, wherein the step of attaching the adhesive layer to a flat disc further comprises fitting an alignment fixture on a periphery of the flat disc, and attaching the adhesive layer to the flat disc depending on a hollow area formed by the alignment fixture.
 6. The diamond polishing disc process as claimed in claim 1, wherein the woven layer is a nylon net, and the adhesive material is an adhesive tape.
 7. The diamond polishing disc process as claimed in claim 1, wherein the polymer material is an epoxy resin.
 8. The diamond polishing disc process as claimed in claim 1, wherein a mesh size of the woven layer is between 190 μm to 220 μm.
 9. The diamond polishing disc process as claimed in claim 1, wherein a diameter of the diamond particles is between 250 μm to 300 μm.
 10. A manufacturing mold, for implanting a plurality of diamond particles and filling a liquid substrate material so as to manufacture a diamond polishing disc, comprising: an accommodation unit, for providing a space for filling the liquid substrate material therein; and an adhesive layer, disposed in the accommodation unit, and having a nylon net and an adhesive material covered on outer sides of the nylon net, such that the diamond particles are adhered in a plurality of meshes of the adhesive layer.
 11. The manufacturing mold as claimed in claim 10, wherein the woven layer is a nylon net, and the adhesive material is an adhesive tape.
 12. The manufacturing mold as claimed in claim 10, wherein the substrate material is a polymer material.
 13. The manufacturing mold as claimed in claim 12, wherein the polymer material is an epoxy resin.
 14. The manufacturing mold as claimed in claim 10, wherein the meshes of the woven layer are of the same size or different sizes.
 15. The manufacturing mold as claimed in claim 10, wherein a mesh size of the woven layer is between 190 μm to 220 μm.
 16. The manufacturing mold as claimed in claim 10, wherein a diameter of the diamond particles is between 250 μm to 300 μm.
 17. The manufacturing mold as claimed in claim 10, wherein the accommodation unit further comprises: a flat disc, on which the adhesive layer is attached; and an outer ring, having a hollow structure corresponding to the flat disc, and fitted on the flat disc to form an accommodation space.
 18. The manufacturing mold as claimed in claim 17, wherein the flat disc further comprises a protrusion.
 19. The manufacturing mold as claimed in claim 17, wherein the flat disc further comprises a recess. 